Non-mobile applications including HPC and automotive expected to exceed 50% of its foundry portfolio by 2027
Samsung Electronics, a world leader in advanced semiconductor technology, announced a strengthened business strategy for its Foundry Business with the introduction of cutting-edge technologies at its annual Samsung Foundry Forum event.
With significant market growth in high-performance computing (HPC), artificial intelligence (AI), 5/6G connectivity and automotive applications, demand for advanced semiconductors has increased dramatically, making innovation in semiconductor process technology critical to the business success of foundry customers. To that end, Samsung highlighted its commitment to bringing its most advanced process technology, 1.4-nanometer (nm), for mass production in 2027.
During the event, Samsung also outlined steps its Foundry Business is taking in order to meet customers’ needs, including: △foundry process technology innovation, △process technology optimization for each specific applications, △stable production capabilities and △customized services for customers.
“The technology development goal down to 1.4nm and foundry platforms specialized for each application, together with stable supply through consistent investment are all part of Samsung’s strategies to secure customers’ trust and support their success,” said Dr. Siyoung Choi, president and head of Foundry Business at Samsung Electronics. “Realizing every customer’s innovations with our partners has been at the core of our foundry service.”
Showcasing Samsung’s Advanced Node Roadmap Down to 1.4nm in 2027
With the company’s success of bringing the latest 3nm process technology to mass production, Samsung will be further enhancing gate-all-around (GAA) based technology and plans to introduce the 2nm process in 2025 and 1.4nm process in 2027.
While pioneering process technologies, Samsung is also accelerating the development of 2.5D/3D heterogeneous integration packaging technology to provide a total system solution in foundry services.
Through continuous innovation, its 3D packaging X-Cube with micro-bump interconnection will be ready for mass production in 2024, and bump-less X-Cube will be available in 2026.
Above, Dr. Siyoung Choi, president and head of Foundry Business at Samsung Electronics, is giving his keynote speech at Samsung Foundry Forum 2022
