PUBLICACION ONLINE SOBRE ICT Y TELECOMUNICACIONES En español e inglés / spanish and english
PUBLICACION ONLINE SOBRE ICT Y TELECOMUNICACIONES En español e inglés / spanish and english
Chip to rackscale AI solutions delivered to customers with the help of strategic industry partners Today at Computex 2026, Intel unveiled new innovations that address customers’ chip-to-systems-level AI needs with
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ANRITSU CORPORATION and LG Electronics Inc. (LG) announce the successful validation of LG’s in vehicle system (IVS) for Hybrid eCall operation, demonstrating conformance with the latest European standards EN 18052:2025
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These milestones are key steps toward proving the viability of cellular technologies for critical communications on future lunar missions Nokia announced it successfully delivered the first cellular network to the
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Today, more and more wearable electronics are used for monitoring health and wellness. A project coordinated by VTT is researching new measurement technologies to produce continuous, more accurate data on
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Before appearing on a screen in your hand or on your desk, this story and its photos existed as pulses of light, fired by lasers, that passed through strands of
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Stratospheric system enables connectivity at scale, with one platform capable covering the equivalent area of 500 towers and delivering significantly more efficient signal strength than LEO satellites Sceye, a U.S.
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At MWC 2026, Viasat and Cubic³ – in association with Qualcomm – will showcase satellite-enabled voice calling capabilities for software-defined-vehicles Viasat and Cubic³, in association with Qualcomm Technologies, Inc. and
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We’re awarding 25 Accelerator Grants to organizations that use our AI glasses to scale their impact, and five Catalyst Grants to organizations proposing new, innovative applications using the Meta Wearables
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Hyundai Motor Group debuts real-world human-centered AI Robotics at CES 2026 Hyundai Motor Group (the Group) unveiled its transformative AI Robotics Strategy at the Consumer Electronics Show 2026 (CES 2026),
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Through AI, Siemens and NVIDIA are reinventing the entire end-to-end industrial value chain — from design and engineering to manufacturing, production, operations and into supply chains Siemens and NVIDIA announced
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Publicación online sobre telecomunicaciones y tecnologías de la información, en castellano e inglés / Online publication about telecommunications and ICT, in english and spanish
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